Flow-control parts
Baffles & Flow Diffuser Assemblies
Plates, rings and assemblies evaluated for hole pattern, effective flow area, flatness and mounting datum.
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Semiconductor applications
Dry etching
Plasma etch · Chamber support
Baffles, shields and optical-window candidates reviewed for their specific chamber position and exposure.
Process overview
Where the components fit
Etching removes selected material to form features in a semiconductor structure. Dry etching commonly uses plasma, and the process must control feature shape while limiting unwanted removal of other materials.
Chamber components have different exposure and interface requirements from the wafer itself. The existing WONIK product families include baffle and flow-control assemblies and quartz viewing-window candidates; each requires review of material, chamber location, surface requirements and customer qualification criteria.
- 01
Define the etch environment
The target material, plasma chemistry and chamber conditions establish the context for assessing exposed components.
- 02
Locate the component
Baffles, shields and viewing windows occupy different positions. Geometry, mounting datums and sealing edges must be defined for the intended role.
- 03
Set the qualification requirements
The customer defines acceptance for material, surfaces, dimensions and any required optical performance before tool qualification.
Conceptual application guide—not an equipment operating procedure or a manufacturing recipe.
From process to part
Related component families
Representative product families for technical review. Listing a component here does not establish compatibility with a specific tool or process.
Before quotation
Define your application.
Plasma resistance, optical suitability and tool compatibility cannot be inferred from a quartz or silicon label. These product families are review candidates, and no unverified chamber compatibility or process-performance claim is implied.
Request a technical review- Chamber module, component location and drawing revision
- Plasma chemistry and process or cleaning exposure
- Confirmed material grade and surface requirements
- Mounting datums, seal geometry and any optical wavelength requirement
- Customer inspection and tool-qualification criteria