Wafer carriers
Quartz Wafer Boats
Drawing-based horizontal and custom carriers with slot geometry developed around the substrate and loading method.
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Semiconductor applications
Thermal processing
Oxidation · Diffusion · Annealing
Carriers, process tubes and thermal-support components for drawing-led furnace applications.
Process overview
Where the components fit
Thermal processing uses controlled heating to change a material or support a reaction. Oxidation, diffusion and annealing serve different purposes, and the temperature profile, atmosphere and time exposure depend on the device and process stage.
In suitable batch-furnace applications, wafer boats hold substrates while process tubes define the surrounding process space. WONIK reviews quartz and silicon carriers, tubes and thermal-support assemblies against the customer drawing, loading arrangement and acceptance criteria.
- 01
Support the substrates
Carrier orientation, slot geometry and loading interfaces define how wafers are positioned within the intended equipment.
- 02
Control the thermal environment
The furnace combines a defined atmosphere with a controlled heating cycle. Tube geometry and support position must be reviewed for that application.
- 03
Check the component requirements
Material, dimensional, cleanliness and inspection requirements are agreed before a component enters the customer qualification process.
Conceptual application guide—not an equipment operating procedure or a manufacturing recipe.
From process to part
Related component families
Representative product families for technical review. Listing a component here does not establish compatibility with a specific tool or process.
Wafer carriers
Vertical Quartz Wafer Boats
Vertical batch-carrier structures evaluated for coaxiality, accumulated slot error and wafer support geometry.
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Wafer carriers
Silicon (Si) Wafer Boats
Drawing-based silicon wafer carriers reviewed against the confirmed silicon grade, slot geometry and customer qualification criteria.
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Process tubes & chambers
Quartz Process Tubes
Inner, outer and assembled quartz tubes with interfaces, branches and sealing surfaces controlled to the drawing.
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Thermal-zone components
Thermal Field & Insulation Assemblies
Thermal-zone and insulation candidates reviewed only after material, temperature profile and assembly position are confirmed.
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Define your application.
Silicon (Si) and silicon carbide (SiC) are different materials. The silicon wafer boats shown here are Si products. No carrier, tube or thermal-support assembly is qualified for a tool or thermal cycle by its product name alone.
Request a technical review- Wafer or substrate size, batch capacity and loading orientation
- Furnace arrangement, component position and mating interfaces
- Temperature profile, process atmosphere and pressure
- Confirmed material grade, surface and cleanliness requirements
- Drawing revision, inspection criteria and qualification route